SK Hynix Denies Confirmed Plans for Intel's Ohio Chip Facility

SK Hynix has issued a firm denial regarding reports of confirmed plans to acquire Intel’s Ohio chip campus. The South Korean memory giant emphasized that it has not engaged in any acquisition discussions, although it acknowledged ongoing evaluations of various production strategies.

The speculation began after Korea JoongAng Daily reported potential talks between SK Hynix and Intel about the under-construction Ohio facility, which is intended for front-end memory chip production. Following this, SK Hynix issued a regulatory clarification in July 2026, denying any acquisition talks. However, in September, Reuters reported that exploratory discussions were ongoing, focusing on possible collaborations or leasing arrangements rather than outright acquisition.

Intel has reaffirmed its commitment to the Ohio operations, which broke ground in 2022, with production now expected to start around 2030-2031. SK Hynix is not new to significant dealings with Intel, having previously acquired Intel’s NAND flash memory business for $9 billion.

In addition to its previous dealings, SK Hynix is investing $4 billion in an advanced packaging facility in Indiana, set to begin mass production in 2029. This project focuses on the back-end packaging process, while the Ohio facility would represent a significant step into front-end memory chip manufacturing for SK Hynix.

A potential leasing or collaboration arrangement could benefit both companies, allowing Intel to justify its investment while providing SK Hynix access to a state-of-the-art facility. However, SK Hynix has made it clear that there are no confirmed plans at this time.